As a specialist packaging supplier based in China, Kalefu Packaging offers the Scratch Off Foil designed for secure hot stamping applications where clean, effortless removal is mandatory. This dedicated foil combines reliable adhesion with controlled release, directly addressing security packaging and promotional item requirements without residue or substrate damage.
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Model |
Application Focus |
Substrates |
|
SCF-PL |
Plastic & Laminated Surfaces |
PVC and laminated surfaces |
|
SCF-UV |
UV-Coated Surfaces |
UV varnish and UV ink surfaces |
|
SCF-PA |
Paper & Ink Surfaces |
Art paper with standard wear-resistant varnish and standard ink surfaces |
Temperature: 90–110°C (adjust within this range)
Adjustment Criterion: Stamping temperature should be adjusted between 90°C and 110°C, ensuring the foil can be easily scratched off the substrate after transfer. Conduct sample
tests to determine the optimal setting.
Note: All three SCF models are designed for hot stamping processes where the foil is transferred to the substrate and then hidden beneath a scratch-off coating. The key performance indicator is
reliable adhesion combined with clean scratch-off behavior.
Security labels and tamper-evident seals for pharmaceutical blister packs, electronics warranties, and luxury authentication
Promotional scratch cards, gift vouchers, membership cards, and instant-win lottery tickets
Anti-counterfeiting tags for automotive parts, cosmetic cartons, and premium spirits packaging
Flexible packaging overlays requiring concealed PIN codes, serial numbers, or one-time coupon reveals
All three SCF models are purpose-built for hot stamping processes where the foil transfers onto the substrate and sits beneath a functional scratch-off coating. The critical performance indicators are dependable adhesion during logistics and clean, residue-free scratch-off action for end-users. Always conduct production trials with your actual equipment, dwell time, and ambient conditions before full-scale runs.
For the Scratch Off Foil requirements beyond standard options, Kalefu Packaging provides custom roll widths, splice-free lengths, and adhesion tuning for specific surface treatments. Direct engineering support is available for die optimization, substrate testing, and formulation adjustments to match unique production constraints.